2027

无锡半导体展B3 馆平面图

B3 hall

芯片制造及封装展区

Chip Manufacturing and Packaging Exhibition Area

B3

B3 馆平面图展位编号与出入口位置

100%

B3 馆芯片制造及封装展区平面图

B3 Hall · Chip Manufacturing and Packaging Exhibition Area原图比例保持不变