2027

无锡半导体展B1 馆平面图

B1 hall

芯片制造及封装展区

Chip Manufacturing and Packaging Exhibition Area

B1

B1 馆平面图展位编号与出入口位置

100%

B1 馆芯片制造及封装展区平面图

B1 Hall · Chip Manufacturing and Packaging Exhibition Area原图比例保持不变